Our comprehensive electronics repair, remanufacturing, and testing services are designed to extend the life and performance of your critical electronic components and assemblies. Leveraging years of expertise in contract electronics manufacturing, we provide specialized solutions tailored to meet the demanding needs of industries ranging from medical and automotive to aerospace and industrial automation.
Services We Offer
Component-Level Repairs
Diagnosing and resolving issues at the component level, from minor fixes to complex circuitry adjustments.
Remanufacturing Services
Functional Testing & Quality Assurance
Failure Analysis
Advanced Testing Capabilities
Our state-of-the-art testing facilities ensure that each repaired or remanufactured electronic component meets the highest standards of quality, safety, and performance. We use rigorous testing protocols to validate reliability, helping our clients maintain optimal functionality across various applications. Our advanced testing capabilities include:
Electrical Testing & Signal Integrity
Our electrical testing services evaluate the performance of circuits and components under operational and maximum load conditions. We focus on parameters such as current leakage, voltage stability, and signal integrity, confirming that each device performs reliably without electrical interference or degradation in signal quality.
Performance Benchmarking
Our performance benchmarking tests measure the repaired or remanufactured components against industry and manufacturer specifications. We assess key metrics such as response time, processing power, and overall efficiency, ensuring that each component can perform as expected under actual use cases. This provides peace of mind that components are fully optimized and reliable.
Burn-In Testing
Burn-in testing subjects components to elevated temperatures and voltages over an extended period, identifying early-life failures and ensuring long-term reliability. By replicating prolonged operational stress, we catch potential weaknesses in components that might only surface after continuous use, enhancing durability and customer satisfaction.
Functional and End-of-Line Testing
Every repaired or remanufactured component undergoes functional testing to ensure that it operates correctly within its intended application. Our end-of-line testing protocols confirm that all repaired units are fully operational, verifying functionality before they leave our facility. This comprehensive approach minimizes field failures and guarantees that each component is ready for immediate deployment.
X-Ray and Imaging Inspection
For critical components like BGAs (Ball Grid Arrays) and other high-density interconnections, we use X-ray inspection to check for solder joint integrity, hidden defects, and structural anomalies. This non-destructive testing method allows us to identify hidden issues that might affect component performance or reliability, particularly valuable for high-complexity electronics.
Automated Optical Inspection (AOI)
Our Automated Optical Inspection system captures high-resolution images of repaired or remanufactured PCBs and uses advanced algorithms to detect even the smallest inconsistencies. AOI helps us catch potential errors or defects early in the process, ensuring each board is in top condition.
Failure Analysis and Root Cause Investigation
In cases where components have recurrent issues, we conduct a detailed failure analysis to identify the root cause. This involves a systematic examination, including thermal and mechanical stress testing, to determine why a failure occurred. Our findings often provide insights for design improvements and future preventive measures.
